CVD diamond heat sink to assist advanced packaging heat dissipation

With the development of semiconductor technology, the improvement of chip performance poses a significant challenge to heat dissipation. Moore's Law is slowing down, and the process is approaching its limit. Advanced packaging is the key to continuing the performance improvement. In this context, High Light Intelligence Technology, with its independently developed MPCVD technology, brings more possibilities for advanced packaging and heat dissipation solutions.

In 2.5D/3D packaging, chip integration and power density increase, and heat dissipation becomes a bottleneck for performance improvement. Traditional heat dissipation materials are difficult to meet high-power requirements. High Light Intelligence Technology's CVD diamond heat sink has high thermal conductivity, which can reduce chip temperature and improve stability. There are successful cases in the field of semiconductor lasers, with excellent performance in cooling, increasing power, reducing resistance, and prolonging lifespan.

Technical Advantages

CVD diamond heat sink has significant advantages, with a thermal conductivity of up to 1500-2300W/m · K, which can quickly dissipate chip heat, maintain low-temperature stable operation, and avoid performance degradation; The low thermal expansion coefficient ensures dimensional stability at high temperatures and prevents thermal stress from affecting chip reliability; Excellent dielectric performance ensures stable signal transmission, provides a stable electrical environment for chips, and ensures accurate and efficient signals.

Industrial Innovation

High Light Intelligence Technology has independently developed MPCVD technology and equipment, which accurately controls the growth of high-quality CVD diamond heat sinks, ensuring product stability and consistency, and more independent and flexible research and development innovation. Support customization of 3x3-20x20mm sizes to meet diverse needs. Advanced precision machining technology is also adopted to achieve high precision on the surface of the heat sink, increase the contact area, reduce contact thermal resistance, and improve heat dissipation efficiency.

Market and Application

The development of cutting-edge technologies such as artificial intelligence has led to a significant increase in demand for high-performance chips, and CVD diamond heat sinks have broad prospects as key materials for heat dissipation. High Light Intelligence Technology will increase research and development, optimize processes, reduce costs, and promote its application in multiple fields. In addition to semiconductors, there is enormous potential in fields such as aerospace and new energy vehicles, such as thermal management for spacecraft and improving the heat dissipation efficiency of new energy vehicle batteries.

High Light Intelligence Technology, a pioneer in the CVD diamond industry, has advanced MPCVD technology and CVD diamond production workshops. We focus on producing high-purity lab-grown diamonds for the jewelry industry, and at the same time create industrial-grade CVD diamond products, covering single crystals, polycrystalline, films and diamond surface metallization. We also provide 6kw/10kw/15kw MPCVD equipment to help customers in all aspects, from equipment to products, and then to all-round services, to create brilliance together.

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CVD diamond heat sink to assist advanced packaging heat dissipation

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