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Huawei and Harbin Institute of Technology jointly publish patents for three-dimensional integrated chips based on silicon and diamond
2023-12-01 11:19:44
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Recently, a patent for "a hybrid bonding method for three-dimensional integrated chips based on silicon and diamond" applied by Huawei Technologies Co., Ltd. and Harbin Institute of Technology was published. The substantive review will take effect on November 14. This invention patent will greatly benefit diamond
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Recently, a patent for "a hybrid bonding method for three-dimensional integrated chips based on silicon and diamond" applied by Huawei Technologies Co., Ltd. and Harbin Institute of Technology was published. The substantive review will take effect on November 14. This invention patent will greatly benefit the development of the diamond industry, provide important basis and reference for the application of diamond chips, and promote major changes in the field of chip manufacturing.
It is understood that the mainstream direction of the development of the semiconductor industry is three-dimensional integration technology. However, as the integration density continues to increase and feature sizes continue to shrink, the thermal management of electronic chips faces great challenges. The heat accumulated inside the chip is difficult to transfer to the heat sink on the package surface, resulting in a sudden increase in internal junction temperature, which seriously threatens chip performance, stability, and service life.
As a semiconductor diamond production supplier, High Light Intelligence Technology is developing rapidly in the semiconductor industry. We also provide diamond materials to major commercial customers and academic researchers, contributing to the development of semiconductor technology and materials.
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